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Full Picture report: The Packaging Design for a SiC MOSFET Power Module with High-Temperature Characteristics | IEEE Conference Publication | IEEE Xplore https://www.fullpicture.app/item/8ea425914dbe03cbd2f30da2dda9ae31
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Full Picture report: The Packaging Design for a SiC MOSFET Power Module with High-Temperature Characteristics | IEEE Conference Publication | IEEE Xplore https://www.fullpicture.app/item/8ea425914dbe03cbd2f30da2dda9ae31
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