1. This paper aims to understand the mechanism of infrared nanosecond laser ablation of silicon, by combining time-resolved experimental observations with physics-based modeling study.
2. The research shows that the material removal mechanism under the studied laser ablation conditions is surface vaporization in the early stage, followed by subsequent liquid ejection.
3. The study also shows that the observed liquid ejection is induced by the total surface pressure difference between the near-boundary region of the target melt pool and the other remaining region of the pool.
The article “Infrared long nanosecond laser pulse ablation of silicon: Integrated two-dimensional modeling and time-resolved experimental study” provides a comprehensive overview of infrared nanosecond laser ablation of silicon, combining both experimental observations and physics-based modeling studies. The article is well written and provides a clear explanation of its findings, making it easy to follow for readers with some knowledge in this field.
The article does not appear to be biased or one-sided in its reporting, as it presents both sides equally and does not make any unsupported claims or omit any points of consideration. Furthermore, all claims made are supported by evidence from experiments and models, which adds to its trustworthiness and reliability. Additionally, no promotional content was found in this article, nor was there any partiality towards either side presented in it.
The only potential issue with this article is that it does not explore any counterarguments or possible risks associated with infrared nanosecond laser ablation of silicon. This could be addressed by including a section discussing potential risks or counterarguments related to this topic, which would further add to its trustworthiness and reliability.