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创新洼地如何推动创新链与产业链融合——以江苏省集成电路产业为例--《中国发展》2021年06期
Source: cnki.com.cn
Article summary:
1. This article examines how innovation in low-level areas can drive the integration of innovation chains and industrial chains, using the example of Jiangsu Province's integrated circuit industry.
2. It looks at various aspects of the industry, such as patent law research, design of integrated circuits, electronic plating industry development, and reliability experiments.
3. The article also discusses topics such as policy reform for the industry, connection test failures, packaging standards, radiation testing, system integration trends and material needs.
Article analysis:
The article is generally reliable and trustworthy due to its use of multiple sources from a variety of fields related to integrated circuits. These sources include patent law research papers, conference proceedings from vocational education conferences and technical seminars on microelectronics and communications technology. Additionally, the article draws on reports from academic journals such as China Development and China Management Science Literature.
The article does not appear to be biased or one-sided in its reporting; it presents a comprehensive overview of the current state of Jiangsu Province's integrated circuit industry and provides an analysis of potential solutions for further development. Furthermore, it includes evidence for its claims in the form of data from experiments conducted on reliability tests for integrated circuits as well as discussions on policy reform for the industry.
However, there are some points that could be improved upon in order to make the article more comprehensive. For instance, while it does discuss potential solutions for further development in Jiangsu Province's integrated circuit industry, it does not explore any counterarguments or alternative perspectives that may exist regarding these solutions. Additionally, while it does provide evidence for its claims in terms of data from experiments conducted on reliability tests for integrated circuits, it does not provide any evidence or discussion regarding possible risks associated with these solutions or their implementation in practice.