1. Laser processing can achieve high transverse precision, but controlling the axial penetration depth has been difficult.
2. Normal imaging techniques provide minimal depth information and may be blinded by intense backscatter, black body and plasma emission.
3. Inline coherent imaging (ICI) provides in situ, micron-scale depth measurements of laser machining processes at >300 kHz without any requirement for sample transparency or specialized geometry.
The article is generally reliable and trustworthy as it provides a detailed overview of the potential of inline coherent imaging (ICI) to monitor and control laser machining processes at kHz rates. The article is well-researched and supported with evidence from previous studies, making its claims credible. However, there are some points that could be further explored in order to make the article more comprehensive. For example, the article does not mention any potential risks associated with using ICI for process monitoring and control, such as safety concerns or cost implications. Additionally, the article does not explore any counterarguments or alternative solutions to the problem of controlling axial penetration depth in percussion drilling and keyhole welding. Furthermore, while the article does provide evidence for its claims, it does not present both sides equally; instead it focuses solely on the benefits of ICI without exploring any potential drawbacks or limitations. Finally, there is a lack of discussion about how ICI can be integrated into existing laser processing platforms in order to maximize its effectiveness.