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Article summary:
1. The ability to deposit thin films with precise thicknesses and in a sequential order is necessary for modern optoelectronic devices.
2. Solvent-free transfer (SFT) is a process that enables the deposition of pre-solidified films, avoiding solvent incompatibility and conformally coating textured structures.
3. SFT has been demonstrated to be viable for depositing over large areas, forming and transferring free-standing films up to 10 x 10 cm2 in area, with thicknesses of ≈20 nm.
Article analysis:
The article provides an overview of the solvent-free transfer (SFT) process for depositing pre-solidified films onto large substrates (>100 cm2). The article is well written and provides a comprehensive description of the process, including details on the formation of freestanding films, their survivability during drawing, strategies to mitigate the impact of polymer toughness on the process, and techniques used to assess film uniformity.
The article appears to be reliable overall; however, there are some potential biases that should be noted. For example, while the article does provide an overview of various polymers tested with SFT, it does not explore any counterarguments or alternative approaches that could be used instead. Additionally, while the article does mention possible risks associated with SFT such as air pockets forming during transfer, it does not provide any evidence or further discussion on how these risks can be mitigated or avoided.
In conclusion, this article provides a detailed overview of solvent-free transfer (SFT) for depositing pre-solidified films onto large substrates (>100 cm2). While generally reliable overall, there are some potential biases that should be noted such as lack of exploration into counterarguments or alternative approaches and lack of evidence or further discussion on how possible risks associated with SFT can be mitigated or avoided.