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Article summary:

1. TSMC has officially introduced its N2 (2nm class) manufacturing technology, which uses gate-all-around field-effect transistors (GAAFETs).

2. The new fabrication process will offer a full-now performance and power benefits, but it will only increase chip density by around 1.1X compared to N3E.

3. TSMC will begin high-volume manufacturing of chips using its N2 node in the second half of 2025.

Article analysis:

The article is generally reliable and trustworthy as it provides accurate information about TSMC's new 2nm node and its features. It also provides an overview of the expected performance and power benefits that the new node will bring, as well as an estimated timeline for when it will be available for commercial use. The article does not appear to have any biases or one-sided reporting, nor does it make unsupported claims or omit important points of consideration. Furthermore, all claims made are supported with evidence from the source material provided by TSMC at its 2022 Technology Symposium. The article also does not contain any promotional content or partiality towards either side of the argument, and possible risks are noted where applicable. In conclusion, this article is reliable and trustworthy in providing accurate information about TSMC's new 2nm node.