1. TSMC recently held their annual Technology Symposium in Santa Clara, CA, providing a comprehensive overview of their status and upcoming roadmap.
2. The volume of 12” (equivalent) wafers has had an annual CAGR exceeding 70%, with a significant increase in the number of ‘big die’ products.
3. TSMC is investing heavily in “intelligent manufacturing”, focusing on precision process control, tool productivity, and quality.
The article provides an overview of the highlights from TSMC's recent Technology Symposium in Santa Clara, CA. The article is generally reliable and trustworthy as it provides accurate information about the company's current status and future plans. However, there are some potential biases that should be noted. For example, the article does not provide any information about other companies or competitors in the industry which could provide a more balanced view of the market landscape. Additionally, there is no mention of any potential risks associated with TSMC's plans or any counterarguments to their strategies which could be explored further for a more comprehensive understanding of the situation. Furthermore, some claims made by TSMC are not supported by evidence which could lead to confusion or misunderstanding among readers. Finally, there is some promotional content included in the article which could be seen as biased towards TSMC's products and services.