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Article summary:
1. The removal rate and subsurface damage of diamond during CMP are affected by the flow and pressure of the polishing slurry.
2. C–O–C and C–C bonds cause more friction force and friction coefficient.
3. Low pressure and high flow can achieve low friction and wear mechanism.
Article analysis:
The article provides an insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond, using reactive molecular dynamics simulation to elucidate the friction behavior under different pressures and flow fates of polishing slurry. The article is well-written, with clear explanations of the research methods used, as well as a comprehensive discussion on the results obtained from the simulations.
The article does not appear to be biased or one-sided in its reporting, as it presents both sides of the argument equally. It also does not contain any promotional content or partiality towards any particular viewpoint or opinion. Furthermore, all claims made in the article are supported by evidence from experiments or simulations conducted by other scholars in related fields, which adds to its trustworthiness and reliability.
However, there are some points that could have been explored further in order to provide a more comprehensive understanding of the topic at hand. For example, while the article discusses how pressure affects passivation of surface, it does not explore how temperature affects this process as well. Additionally, while it mentions that load can increase passivation effects of diamond, it does not discuss what other factors may affect this process as well.
In conclusion, overall this article is reliable and trustworthy due to its comprehensive discussion on relevant topics related to chemical mechanical polishing (CMP) processes for diamond surfaces, supported by evidence from experiments or simulations conducted by other scholars in related fields. However, there are some points that could have been explored further in order to provide a more comprehensive understanding of the topic at hand.