1. A hot-pressing strategy was used to fabricate epoxy resin/oriented BN composites, which resulted in a well-ordered BN microstructure and an elevated thermal conductivity of up to 6.09 W m−1K−1 at 50 wt% loading.
2. The enhanced mechanical properties of the composites are attributed to the increased friction area along the tensile in-plane direction and the decreased defects during fabrication.
3. This study provides insight into exploring future thermal management materials for heat dissipation demands.
The article is generally reliable and trustworthy, as it provides detailed information about the fabrication process of epoxy resin/oriented BN composites, as well as their improved thermal conductivity and mechanical properties. The authors also provide evidence for their claims by citing relevant research studies from other sources, which adds credibility to their findings. Furthermore, they discuss potential risks associated with their work, such as phonon spectrum mismatch between organic polymer resins and inorganic ceramic phases that can heavily deteriorate the efficiency of phonon transferring.
However, there are some points that could be further explored in order to make the article more comprehensive and reliable. For instance, while discussing surface modification strategies for improving compatibility between resin and filler interfaces, more details could be provided regarding how these strategies can reduce thermal interface resistance. Additionally, while discussing orientation strategies for achieving higher thermal conductivity of polymer composites, more examples could be provided to illustrate how different orientation techniques can affect thermal conductivity levels. Finally, while discussing potential risks associated with their work, more details could be provided regarding how these risks can be mitigated or avoided altogether.