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Article summary:

1. An orthogonal test was conducted to investigate the effects of polishing parameters on the surface quality of sapphire after double-sided chemical mechanical polishing (CMP).

2. The results showed that polishing pressure and carrier rotation speed have a significant positive correlation effect on material removal rate and subsurface damage depth.

3. An optimization method based on weight matrix was used to obtain the optimal process parameter combinations for higher material removal rate, lower surface roughness, and lower subsurface damage depth.

Article analysis:

The article “Effects of Polishing Parameters on Surface Quality in Sapphire Double-Sided CMP” is a well-written and comprehensive study that provides an in-depth analysis of the effects of different polishing parameters on the surface quality of sapphire after double-sided chemical mechanical polishing (CMP). The authors provide a detailed description of their research methodology, including an orthogonal test to investigate the effects of various parameters such as polishing pressure, carrier rotation speed, and polishing time. They also present their findings in a clear and concise manner, providing evidence for their claims with data from experiments.

The article is generally reliable and trustworthy; however, there are some potential biases that should be noted. For example, the authors do not explore any counterarguments or alternative explanations for their findings. Additionally, they do not discuss any possible risks associated with using certain parameters or processes during CMP. Furthermore, while they provide evidence for their claims with data from experiments, they do not provide any evidence from other sources to support their conclusions. Finally, it should be noted that the authors do not present both sides equally; instead they focus primarily on presenting their own findings without exploring any opposing views or perspectives.

In conclusion, this article is generally reliable and trustworthy; however, there are some potential biases that should be taken into consideration when evaluating its trustworthiness and reliability.